The most experienced US supplier targeting complex wafer dicing and grinding services for diverse market segments including semiconductor, MEMS and life sciences to name a few. Continuity of support from NPI to commercial scale manufacturing for both commercial and military applications. Robust Static and Cleanliness controls capable of the most demanding specifications. GDSI is ISO 9001:2008 registered. Serving fab and fabless interests for over 20 Years. Why gamble with your material? Trust GDSI to process your critical projects. Specialties: Wafer dicing, Stealth Laser Dicing Process, wafer grinding, thinning, polish, inspection, wafer saw, SiC, Glass, Silicon, MEMS, pick & place, 300mm, Die Bonding