Cressem
www.cressem.comCressem is creative assembly solution provider for the Electronics manufacturing industry. Cressem provides Ultrasonic ACF bonding solution of the FOF(Flex On Flex), FOB and FOG assembly. It is the most advanced assembly technology for Display, TSP, Smart card, Wearable & Flexible device, mobile device and smart glass manufacturing business.
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Cressem is creative assembly solution provider for the Electronics manufacturing industry. Cressem provides Ultrasonic ACF bonding solution of the FOF(Flex On Flex), FOB and FOG assembly. It is the most advanced assembly technology for Display, TSP, Smart card, Wearable & Flexible device, mobile device and smart glass manufacturing business.
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Country
City (Headquarters)
Gunpo
Employees
1-10
Founded
2014
Estimated Revenue
$1 to $1,000,000
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President
Email ****** @****.comPhone (***) ****-****Director , Research and Development Strategy Planning in Mirtec
Email ****** @****.comPhone (***) ****-****Country Manager
Email ****** @****.comPhone (***) ****-****Head of Core Technology Research and Development Center in Mirtec
Email ****** @****.comPhone (***) ****-****
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Cressem FAQ
Gunpo, South Korea
Appliances, Electrical, and Electronics Manufacturing
