For over 30 years Midas Technology has been the leading edge of component rework technology for Hi-Rel devices. The goal at Midas is to remove the need for devices leaving the clean room to remove lids and to eliminate the use of hammers to remove die and components from devices. This is accomplished with two Midas exclusive technologies. De-lidders™, have been developed to allow for the removal hermetic lids while maintaining a surface that allows for resealing, in the clean room. Midas offers multiple systems to accommodate almost any package configuration. The DL series de-lidder™ is offered in various sizes for accommodating standard packages and the DF series for managing attached fibers during the de-lidding process. Midas also offers the DR series for removing lids from round packages. HGRS (Hot Gas Rework Stations) are designed to affectively remove die and components from substrates while protecting other temperature sensitive devices on the board. This can be accomplished using Midas’ exclusive high temperature nitrogen jet and shear tool systems. The HGRS-1J has a single jet, for smaller devices. The HGRS-V has dual jets for larger devices.