Axus Technology delivers advanced process expertise, process equipment, and service support for: -- CMP & polishing -- Wafer thinning and grinding -- Edge grinding and profline -- Substrate cleaning applications, and, -- Wafer bonding applications. Axus' customers range from leading edge production semiconductor manufacturers through small development facilities.  We deliver surface processing solutions to a broad range of technologies, including semiconductor, and MEMs device processing, device packaging, TSV/3D Integration, materials processing and development, and for virtually any application where material needs to be made flatter, smoother, or thinner. Axus Technology supports a global customer base and is known for delivering high quality, and often highly customized, processes and equipment -- along with a high quality customer support experience.    The Axus Technology team works with a broad array of substrates and films, applying fundamental and novel process technologies into new product applications.