IceMos Technology Ltd is a leading supplier of high quality thick film bonded SOI (Silicon On Insulator) wafers. Occupying the former BCO Technologies SOI fabrication facilties, we offer the same high quality product range with rapid order turnaround and cost effective pricing. IceMOS is a leader supplier for Si-Si Direct Wafer Bonding. We are also a leader in trench etch and refill technology and offer trench etch and refill services to customers on bulk Si substrates or on SOI. Combining both our SOI and trench etch and refill technology, we offer customers a unique dielectrically isolated substrate preparation service. IceMOS offers custom design Cavity SOI (CSOI) for sensor applications such as pressure sensor, gyro, accelerometer, micro-fluidic etc. IceMOS is also supply Through Silicon Via with experience over 10 years for various applications in particular wafer level packaging.