3D Glass Solutions, Inc. (3DGS) is a private late-stage high-tech manufacturing business headquartered in Albuquerque, New Mexico.  3DGS’ main operations are focused on the fabrication of electronic system and devices using photo-definable glass-ceramics.  3DGS manufactures a wide variety of glass-based system-in-package (SiP) devices and components using its patented low-loss photosensitive APEX® Glass technology for applications in radio-frequency (RF) electronics, photonics, automotive radar, integrated circuit (IC) electronics, medical, aerospace, defense, wireless infrastructure, mobile handset, and Internet of Things (IOT) industries.  3DGS has created foundational patent positions related to all photo-sensitive glass-ceramic materials and devices.  3DGS owns the fundamental intellectual property (IP) for all four positions (materials, design, systems, & manufacturing) related to glass-ceramic devices for the electronics packaging industry.  3DGS leverages its unique product solutions providing device manufacturing and systems integration services for a number of standard and custom products.  We provide our customers complete glass-enabled systems integration services.  Our aim is to provide our customers with an integrative solution in RF electronics and IC packaging that allows them to integrate more components onto a single platform while decreasing overall manufacturing costs.