Beijing ESWIN Technology Group Co. Ltd., is a semiconductor products and services supplier, with its core businesses in IC and Solutions, Silicon Materials, Advanced Packaging and Testing. IC and Solutions Business focuses on mobile devices, smart homes, smart transportation, industrial IoT and other application scenarios, providing customers with IC and solutions in four categories, i.e. display & video, smart connectivity, AIoT and smart processing acceleration. Silicon Materials Business mainly provides 12-inch monocrystalline silicon polished wafers and epitaxial wafers adopting world-leading processes. Advanced Packaging & Testing Business includes rear-end IC packaging and testing, COF tape and panel-level packaging and testing. ESWIN Group boasts an R&D and management team who have rich experiences in global semiconductor field. With its headquarters located in Beijing, ESWIN has R&D centers in Beijing, Haining, Hefei, Chengdu, Xi’an, Southampton in the UK, Seoul in South Korea, and has manufacturing bases in Xi’an, Chengdu, Hefei and Suzhou. Marketing and sales branches have been set up in Hongkong, Guangzhou, Shenzhen, Nanjing, Shanghai, Chinese Taiwan，Silicon Valley in US and Seoul in South Korea.