American Semiconductor

www.americansemi.com

American Semiconductor is the industry leader in physically flexible ICs and Flexible Hybrid Electronics. Our Silicon-on-Polymer™ process transforms standard silicon wafers into physically flexible FleX-ICs™. Flexible Hybrid Electronics are created by combining FleX-ICs with printed electronics and other additive manufacturing techniques. American Semiconductor is your complete services provider for flexible ICs, from concept to fabrication. Whether you have just sketched your concept on the back of a napkin or have a product to replicate, American Semiconductor goes beyond typical manufacturers to ensure your product needs are met. American Semiconductor offers a complete suite of engineering and manufacturing services that enable you to realize your product. We support all aspects of IC design, FleX Silicon-on-Polymer flexible wafer processing, and Flexible Hybrid Systems design & manufacturing. IC & ASIC services include design, verification, layout, foundry selection, foundry management, and test. Engineering support for flexible hybrid systems includes printed electronics design and fabrication, antenna design and fabrication, FleX integration, prototype development, and production.

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American Semiconductor is the industry leader in physically flexible ICs and Flexible Hybrid Electronics. Our Silicon-on-Polymer™ process transforms standard silicon wafers into physically flexible FleX-ICs™. Flexible Hybrid Electronics are created by combining FleX-ICs with printed electronics and other additive manufacturing techniques. American Semiconductor is your complete services provider for flexible ICs, from concept to fabrication. Whether you have just sketched your concept on the back of a napkin or have a product to replicate, American Semiconductor goes beyond typical manufacturers to ensure your product needs are met. American Semiconductor offers a complete suite of engineering and manufacturing services that enable you to realize your product. We support all aspects of IC design, FleX Silicon-on-Polymer flexible wafer processing, and Flexible Hybrid Systems design & manufacturing. IC & ASIC services include design, verification, layout, foundry selection, foundry management, and test. Engineering support for flexible hybrid systems includes printed electronics design and fabrication, antenna design and fabrication, FleX integration, prototype development, and production.

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Country

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State

Idaho

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City (Headquarters)

Boise

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Employees

11-50

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Founded

2001

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Estimated Revenue

$1,000,000 to $5,000,000

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  • Senior Advanced Packaging Manufacturing Engineer

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