-MMIC and MIC design team -Active devices Modeling team (MESFET, pHEMT, HBT) -On wafer measurements instrumentation up to 50 GHz. - Large Signal Measurement by Passive Load-Pull system. -Feasibility and study of new circuit solutions -Customer advisor for the selection of the appropriate technology and foundry -Circuit design and layout -Prototype foundry run -Circuit test and characterization -Prototype modules assembly -Production mask layout -On wafer test definition for production chips sorting