Since 1991 Geringer Halbleitertechnik GmbH & Co KG, based at Barbing near Regensburg, has been established as a machine builder for the semiconductor and sensor industry. We are a leading manufacturer of innovative production systems for the semiconductor industry, building flexible and high-precision multi-chip die bonders for the most complex applications, ultra-precise microassembly systems with a precision of over 1 µm, fully automated front-end systems for processing individual wafers, and integrated back-end systems. What sets us apart is our proximity to our customers – everything we develop and build is tailored directly to our customers, right from the initial idea through to small series of finished production systems.