Offering a full and comprehensive dicing solution, Advanced Dicing Technologies (ADT) develops and manufactures dicing saws, blades and peripherals for dicing of silicon-based ICs, package singulation and hard material microelectronic components (MEC). Israel-based R&D, our engineers strive for excellence, developing innovative solutions for the most challenging needs of various industries, following the ever-growing demand for precise cutting technologies. ADT develops and manufactures unique dicing saws and blades, answering the needs of various industries, such as the semiconductor and microelectronic industry. With over 20 years of experience, our team will do everything to ensure you get the right solution for your challenge. Being a global company with headquarters, offices and sales agents worldwide, our products are designed and produced in ADT's advanced ISO 9001 & 14001 certified facilities.