Progate Group Corporation
www.pgc.com.twCorporate Overview PGC (Progate Group Corporation) was founded in 1991. Headquarter is located in Neihu Technology Park Taipei Taiwan. Being the innovative ASIC turnkey service provider in Taiwan, PGC taped-out successfully more than 1000 projects and produced several hundred million ICs in 27 years. PGC is a member of TSMC Design Center Alliance (DCA) ASIC Service Partner. These ICs were shipped to hundreds of customers in Europe, USA, Japan, Israel, Russia, Korea, Singapore, China and Taiwan. Business Model Portfolio > SOC / ASIC Turnkey Service >> Technology: 10m, 16m, 28nm, 40nm, 55nm, 65nm, 90nm, 0.11μm, 0.13μm, 0.18μm, 0.25μm, 0.35μm, 0.5μm, 0.6μm > SOC Implementation Platform Service > MPW (Multi-Project Wafer) Shuttle Bus Service > GATE ARRAY Turnkey Service > Emb-Array Turnkey Service > FPGA To ASIC Turnkey Service > Spec-in To FPGA Turnkey Service > MLM (Multi-Layer Mask) Turnkey Service > Emb-Flash Turnkey Service > Platform ASIC Turnkey Service >> ARM-based Platform; Andes-base Platform > IP(Special I/O, Mixed Signal, High Density Memory, Flash...) Design Service > APR Design Service > COT(GDSII TO CHIP) Turnkey Service > SiP(System-in-Package) Turnkey Service > SOC / ASIC Product Turnkey Service(PGC + TSMC + ASE) >> Testing Program Development(Chroma 3650(J750), Credence D-10), Logistic, WIP, Tape-out, CP, FT, MP, Package, Testing, Yield Improvement, Corner Run, Failure Analysis, Reliability, Wafer Allocation, Hot Run, Super Hot Run
Read moreCorporate Overview PGC (Progate Group Corporation) was founded in 1991. Headquarter is located in Neihu Technology Park Taipei Taiwan. Being the innovative ASIC turnkey service provider in Taiwan, PGC taped-out successfully more than 1000 projects and produced several hundred million ICs in 27 years. PGC is a member of TSMC Design Center Alliance (DCA) ASIC Service Partner. These ICs were shipped to hundreds of customers in Europe, USA, Japan, Israel, Russia, Korea, Singapore, China and Taiwan. Business Model Portfolio > SOC / ASIC Turnkey Service >> Technology: 10m, 16m, 28nm, 40nm, 55nm, 65nm, 90nm, 0.11μm, 0.13μm, 0.18μm, 0.25μm, 0.35μm, 0.5μm, 0.6μm > SOC Implementation Platform Service > MPW (Multi-Project Wafer) Shuttle Bus Service > GATE ARRAY Turnkey Service > Emb-Array Turnkey Service > FPGA To ASIC Turnkey Service > Spec-in To FPGA Turnkey Service > MLM (Multi-Layer Mask) Turnkey Service > Emb-Flash Turnkey Service > Platform ASIC Turnkey Service >> ARM-based Platform; Andes-base Platform > IP(Special I/O, Mixed Signal, High Density Memory, Flash...) Design Service > APR Design Service > COT(GDSII TO CHIP) Turnkey Service > SiP(System-in-Package) Turnkey Service > SOC / ASIC Product Turnkey Service(PGC + TSMC + ASE) >> Testing Program Development(Chroma 3650(J750), Credence D-10), Logistic, WIP, Tape-out, CP, FT, MP, Package, Testing, Yield Improvement, Corner Run, Failure Analysis, Reliability, Wafer Allocation, Hot Run, Super Hot Run
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General Manager
Email ****** @****.comPhone (***) ****-****Senior Sales and Marketing Director
Email ****** @****.comPhone (***) ****-****Purchasing Manager
Email ****** @****.comPhone (***) ****-****Assistant Manager , Technical Sales&Marketing
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