Applied Materials Technology offers complete turnkey electroplating solutions for specialist applications, fully supported by our extensive laboratory and analysis facilities that ensure consistency and quality: • X-ray fluorescent spectroscopy • Micro-section metallography • Optical microscopy • Electron microscopy with EDAX • Thermal shock testing for accelerated reliability testing For semiconductor applications we offer: • Gold and nickel plating onto silicon • Nickel plating on copper busbars for high reliability applications • Ruthenium plating onto molybdenum or tungsten for ohmic contact • Soft electroless nickel for gold wire bonding Other electroplating services We’re confident that we can meet all of your specialist plating needs; but if you can’t see what you’re looking for, please get in touch: Plating for Transient Liquid Phase (TLP) diffusion bonding Our wide range of capabilities in plating and heat treatments is perfect for TLP diffusion bonding. The preferred system is silver-tin, although other systems (silver-bismuth based) can offer bonding at lower temperatures. Electroforming Our electroplating is complemented by our capabilities in electroforming; in copper and nickel base systems - combined with our state of the art capabilities for plating waxes and soluble plastics or low melting point alloys, allowing us to fabricate complex metallic shells in geometries not possible with other routes. Electroformed shells have low residual stress and are hermetic and are suitable for vacuum applications and for producing low cost moulds. Electrolytic processes Electroless processes Electrophoretic coatings Electropolishing, Anodizing Plating on plastics