Kadco Ceramics

www.kadcoceramics.com

Since 1982, Kadco has focused on the engineering and machining of hard materials into intricate shapes. We have the equipment and expertise to advise on and deliver a wide range of industrial solutions, shaping hard materials for commercial, military, medical and educational institutions. We specialize in - milling - grinding - ID slicing - dicing Our diamond milling and grinding departments are able to work with a wide range of difficult materials, including copper traces on ceramic substrates and tight tolerances on the radius of curvature for piezoceramic lenses. Our ID (internal diameter) slicing are able to produce very thin components of pyrolytic graphite, ferrites, piezoceramics, and Macor. Our dicing experience is able to singulate silicon wafers, create grooves in ceramics and minize burrs on plated electronic components. We have developed techniques for machining: * metal oxides, nitrides and carbides including alumina, zirconia, aluminum nitride and silicon carbide * composites such as glass or ceramic filled plastics and layered structures * hard metals such as tungsten * silicon in wafer and bulk form * piezo ceramics such as PZT, barium titanate and other ferroelectric ceramics * quartz, sapphire and other optical materials We can be reached at 610.252.5424 or www.kadcoceramics.com

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Since 1982, Kadco has focused on the engineering and machining of hard materials into intricate shapes. We have the equipment and expertise to advise on and deliver a wide range of industrial solutions, shaping hard materials for commercial, military, medical and educational institutions. We specialize in - milling - grinding - ID slicing - dicing Our diamond milling and grinding departments are able to work with a wide range of difficult materials, including copper traces on ceramic substrates and tight tolerances on the radius of curvature for piezoceramic lenses. Our ID (internal diameter) slicing are able to produce very thin components of pyrolytic graphite, ferrites, piezoceramics, and Macor. Our dicing experience is able to singulate silicon wafers, create grooves in ceramics and minize burrs on plated electronic components. We have developed techniques for machining: * metal oxides, nitrides and carbides including alumina, zirconia, aluminum nitride and silicon carbide * composites such as glass or ceramic filled plastics and layered structures * hard metals such as tungsten * silicon in wafer and bulk form * piezo ceramics such as PZT, barium titanate and other ferroelectric ceramics * quartz, sapphire and other optical materials We can be reached at 610.252.5424 or www.kadcoceramics.com

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$1 to $1,000,000

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