Kuprion’s™ revolutionary Engineered Copper Material is a highly electrically conductive breakthrough, enabling a new generation of printable electronics and integrated circuit chips. Connections between chip-to-chip or chip-to-board are up to 10 times the electrical and thermal conductivity of existing materials - perfect for smaller and more powerful products from phones to electric cars. Our technology is based on work that began at Lockheed Martin in 2008. They were researching ways to replace traditional solder with a high-performance, RoHS-compliant alternative for high-power, high-reliability applications. With widespread interest from the commercial sector, all rights and patents were transferred to Kuprion in 2019 to commercialize the family of pastes and inks. Since then, Kuprion has garnered Fortune 100 customers, 20 patents, and VC funding with offices and manufacturing in San Jose, CA Inquire at: sales@kuprioninc.com