The alteration and testing of microelectronic components to increase reliability, mitigate tin whiskers, or achieve RoHS compliance. Services include: robotic hot solder dip, column attach, ball grid array (BGA) to column grid array (CGA) conversions, ball attach, BGA reballing, and trim & form. Testing includes: solderability, fine & gross leak, bond pull, ball shear, XRF, failure analysis, and mark permanency. Products include BGA preforms for ball attach or reballing.