Semitool is a world leader in innovation and manufacturing of precision semiconductor manufacturing equipment. The company engages in the design, manufacture, installation, and service of equipment for use in the fabrication of semiconductor devices. Its products are focused on the wet chemical process steps in integrated circuit (IC) manufacturing and include systems for wafer surface preparation and electrochemical deposition (ECD) applications. The company’s primary product is the Raider platform, which is a multi-chamber, single-wafer platform that supports surface preparation and ECD applications. Semitool’s surface preparation systems are designed for front end of line (FEOL), back end of line (BEOL), and wafer level packaging of ICs processes. The single wafer FEOL surface preparation systems are used for photoresist stripping, post etch, and pre-diffusion cleans; and the BEOL surface preparation systems are used for polymer removal and packaging applications. The company’s ECD systems are used to plate copper and other metals, which are used for the IC’s internal wiring, or interconnects; to plate solder and lead free solder bumps for wafer level packaging applications; and to plate other metals for various semiconductor and related applications. Its surface preparation systems are also used for cleaning and etching processes for wafer level packaging. Semitool sells its products to semiconductor manufacturers in North America, Europe, and Asia. The company was founded in 1979 and is headquartered in Kalispell, Montana.