Ziptronix, a leader in developing next-generation semiconductor integration strategies and processes, makes tomorrow’s high performance IC applications available today. Based on the patented low temperature wafer bonding process, ZiBond® technology, and low temperature wafer bonding with buried interconnect, Direct Bond Interconnect (DBI®) technology, enable 3D architectures with the smallest footprint and volumetric size of any technologies available. DBI® technology further improves the performance, increases density, and improves device yield, while providing the lowest cost solution. Backed by the most advanced 3D technologies available, Ziptronix is your partner today and for the future.