Tong Hsing Electronics Phils. Inc. is one of the leading IC Hybrid assembly houses specializing on Chip Scale Package (CSP) – Land Grid Array (LGA) or Ball Grid Array (BGA) packages and other devices such as PCB assembly with Surface Mount Technology (SMT) and Chip on Board (COB) processes, Multi Chip Modules especially on RF Modules, Image Products and Ceramic Assembly manufacturing using Thick Film and DPC process. Clean room environment ranges from class 10, 100, 1000, 10K and 100K. To ensure continuous improvement and to satisfy customer expectations, Tong Hsing Electronics Phils. Inc. adheres to the International Quality Assurance standard model of Quality System Requirements: - ISO9001 - IATF 16949 - ISO14001 - ISO45001 - ISO17025 - ISO13485 - ESDS20.20 - MIL-PRF-19500