Advanced equipment manufacturer, wafer level packaging (WLP) subcontracting service provider and chemistry supplier specialized in electroless under bump metallization (UBM), solder balling and back-end services with more than 25 years of experience after spinning off from the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Germany. Mother company: Nagase & Co., Ltd. with headquarters in Tokyo, Japan Facilities: Nauen, Germany (headquarters), Santa Clara, CA, USA & Penang, Malaysia