Sy&Se SA is a Swiss supplier specialized in bonding glasses with metals or ceramics at low temperature. To ensure our customers competitiveness through innovation, we develop complete bonding/aligner machines for versatile applications, ranging from wafer technology to an extended variety of industrial components. In order to offer specific bonding services, we are also equipped with “ELLSA“, an industrial ICB machine that can be adapted to meet any of your technical requirements. ICB is a new low temperature bonding process applicable to a wide range of materials and shaped substrates. Standard glass materials can be bonded with materials showing large mismatches of coefficients of thermal expansion (CTE) and different compositions such as metals (typically stainless steel, aluminium, or titanium) or ceramics (usually AlN, sapphire or spinel). Shaking up the state of art technology, this versatile, patented process allows working from wafer size up to complex industrial shapes. In order to maximize flexibility and minimize product costs, our industrial ICB machine “ELLSA“ can work both in a standard Anodic Bonding mode and automatically switch to ICB mode to deliver the next generation of packaging.