AEMtec is a leading European solution provider for “next level” advanced microsystems, optoelectronics & packaging services. Microsystems and optical technologies are these days the basis for technological development and innovation. Through high performance engineering in product development, process development and production AEMtec realizes reliable customized solutions – from prototypes to serial production. Our technological competence is assembly and packaging of integrated circuits. We make use of COB, FC combined with SMT under modern cleanroom conditions. In addition to our strength in high-end chip level technologies, AEMtec offers wafer back-end services, including UBM, solder ball attachment, dicing and packaging and box build services which we have been providing for over thirty years. Depending on individual needs, we support our customers along the entire value chain: from engineering, prototyping, testing to serial production and end of life services. Our products find use primarily in medical, data-and telecommunications, industrial, semiconductor and automotive applications.