 State of the art Class 3 facility(all processes in house)  Unparalleled up front engineering support  Dual manufacturing availability(domestic/offshore)  Inventory management  24 hour protos, Variety of lead times as required  Back drilling and via structures to minimize signal noise  High-speed materials ,RF/microwave PCB’s  Blind and buried via technology  Via in pad technology (copper filled and epoxy filled microvias) Complex microvia structures  Differential impedance  Thermal management solutions, Aluminum or copper heatsink  Heavy copper ,High aspect ratio plating  Flex (up to 12 layer) and Rigid-Flex (up to 18 layer) Rigid PCB’s(up to 34 layer)  ITAR Certified, MBE Certified, SDB  Rogers complete series, Taconic, Arlon, Nelco, Megtron, Tachyon, ISOLA, Nelco, Teflon, etc.,