We are one of the world's leading machine manufacturers for placement systems in the high-precision sector offering more than 40 years of experience in the semiconductor industry. We develop, produce and sell Die Bonders from our headquarters in Hennigsdorf. This is near Berlin, Germany. The semiconductor market leads the way for many other markets and is therefore constantly changing. Thanks to our modular and flexible machine concept, combined with our numerous innovative options, we enable our customers to react quickly to new technologies, product requirements and new market situations. As a special feature, all our machines offer a manual mode in which die bonding proto-type and R&D development can be carried out quickly and precisely without complex programming.