SAW COMPONENTS Dresden is a leading developer and producer of Surface-Acoustic-Wave products. We are situated in Germany for more than 25 years. We offer technologies for chip manufacturing and packaging, as well as final Surface Acoustic Wave (SAW) products. This includes lithography for micro structuring with 300nm technology, thin film technology for various metals and isolators from 10 to 1500nm with a very high accuracy, as well as packaging services for SMD and metal packaging of chips with specialties in high temperature packaging for use up to 350°C. The SAW products range from SAW Resonators, SAW Filters and SAW delay lines to SAW sensors for wireless temperature and strain measurement as well as wireless identification.