Hesse Mechatronics, Inc. (formerly Hesse & Knipps, Inc.) is the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for backend semiconductor assembly in the power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics industries. The company designs and manufactures high speed, fully automatic fine pitch thin wire bonders for aluminum and gold round wire and ribbon, and heavy wire bonders for aluminum, gold and copper round wire and ribbon, including HCR™ (High Current Ribbon). The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages. In addition to the most advanced wire bonding equipment, Hesse Mecharonics, Inc. also provides wire bonding equipment training, applications support, development and production of wire bonding prototypes and pre-production manufacturing in four applications and demonstration labs throughout the USA.