IBM Assembly and Test facility in Bromont, Canada has packaged the world’s leading-edge semiconductors for over 45 years. We are known for our comprehensive approach to heterogeneous integration and large area packaging. Our work in areas such as automated silicon photonics packaging and optical technology is unrivaled. IBM will help you deliver differentiated solutions while providing personalized, expert support to meet even the toughest application goals. The IBM mindset is one of quality and performance. We offer full turnkey management, from materials characterization to mechanical, thermal and electrical design. Our customers leverage our deep skillsets in inventory control, world-class failure analysis, and customized programming, burn-in or final test. We are accredited as a North American Microelectronics Trusted source. With a culture of working hand-in-hand with device designers and foundry services, IBM will ensure the effective execution of your new and updated advanced packaging platforms.