We are an R&D-oriented company that specializes in the development of advanced processing technologies for brittle materials used in semiconductor and electronic component materials such as glass, ceramics, SiC and GaN. Using originally developed tools and laser units, we propose the most suitable processing methods and equipment according to material properties and applications. We are further evolving the technology we have accumulated through cutting equipment for flat panel displays (FPDs) such as LCDs and plasma displays, and are taking on the challenge of new fields such as electronic components, semiconductors, and renewable energy, which are expected to grow significantly in the future.