SET supplies equipment and technology to enable high-accuracy assembly and bonding of leading edge devices for the electronics industry. The company's tools include an atmospheric plasma system to reduce native oxides and remove organic contamination from surfaces prior to bonding, plating or coating. We also represent the line of high-accuracy flip chip device bonders and nanoimprint equipment which are frequently used in the fields of infrared imaging devices, MEMS components or 3-Dimensional Integration of IC's. Furthermore, we have created an alliance to advance the state of assembly equipment and processing which is primarily aimed at defense-related technologies. Please visit our website to learn more about our products and services!