Taiwan IC Packaging Co., Ltd. (TICP) is a professional semiconductor IC packaging and testing house. TICP was founded in 1998 in Kaohsiung, Taiwan, and went IPO in 2005. We possess ISO 9001, ISO 14001, OHSAS 18001 IATF 16949 quality certification. Furthermore, we are SONY, Cannon & Samsung Green Partner. We stand for high quality, consistent production, innovation, and sustainability within our company and in our broad ecosystem. We also have other environmental system certifications and are committed to ecological waste reduction and industrial safety-related regulations. TICP's products are divided into miniature integrated circuits (SOIC), SSOIC, TSSOIC, MSOIC), plastic square quadrilateral integrated circuits (QFP, LQFP, TQFP), and IC substrate base miniature integrated circuits (BGA, LGA). The testing business includes circuit probing and final test. The future trend of rapid growth and application in the field of wireless communication, internet, smart home appliance, and Personal Data assistant has driven the necessity of communication, controller, memory, and peripheral chip packaging types to be bound lighter, thinner, shorter and smaller. In response to the development of the overall industry and the needs of the application market, TICP actively invests in the research and mass production of multi-layer die products (STACKED DIE PACKAGE), multi-die products (MCM), and advance packages.