Wafering and Reclaim of SiC Wafers X-trinsic’s services include all process steps to transform a solid puck of SiC into epi-ready or device-ready prime wafers or reclaim existing your existing wafers. Capabilities include: Slicing Edge Grinding Lapping or Grinding Polishing Cleaning SiC Consulting Services SiC consulting services including a wide range of functional areas including: Market development Marketing Product Management Sales Account Management Process Technology Support