QP Technologies (formerly Quik-Pak), a division of Promex Industries, specializes in IC packaging and assembly services, as well as wafer preparation and custom substrates. We offer packaging and assembly processes that help quickly bring your design to market. QP Technologies' capabilities include packaging and assembly for prototype through high volume production. ▪ Broad range of package types including Open-molded Plastic Packaging (OmPP), Open Cavity Plastic Packaging (OCPP) and over-molded QFNs ▪ Custom-molded QFN packages available in high volume ▪ Die/wire bonding, encapsulation, and marking/branding ▪ Assembly services for flip chip, ceramic packages, chip-on-board, stacked die, and MEMS ▪ Wafer preparation services - dicing, back grinding, and die sorting ▪ Full turnkey packaging and assembly ▪ Substrate design and fabrication https://www.qptechnologies.com Contact us directly at moreinfo@qptechnologies.com