Printed Circuit Board Prototyping, Assembly, and Producibility Engineering. Specializing in surface mount and other state of the art assembly technologies such as BGA (Ball Grid Array), Micro BGA, CSP (Chip Scale Packages), and FC (Flip Chip). Documented quality system ensures the construction of high quality products and most of all compliance with the specific requirements of our customers. Quite knowledgeable in post assembly testing, engineering and prototyping, and rework and repair. Expertise and comprehensive experience base translates into lower costs and quicker turnaround.