TMX Scientific provides thermoreflectance-based systems and advanced software programs to propel innovation, shorten design cycle time, and troubleshoot thermal challenges in the microelectronics industry. Our services and measurement systems are ideal for measuring surface temperature fields with submicron resolution, determining material thermal properties of thin-film layers, and characterizing heat conduction in complex 3D devices. The TMX Scientific product suite includes T°Imager®, a submicron thermoreflectance CCD microscopy system; Transometer™, the first commercially available thermoreflectance-based metrology system that measures material thermal properties of thin-film layers; T°Pixel®, an application that enables pixel-perfect temperature differential maps and statistics-driven filtering; and T°Solver™, a patented, ultra-fast, self-adaptive computational software application that computes the heat distribution of complex microelectronics devices in 3D. The accuracy of our high resolution submicron measurement coupled with the speed of our patented computational simulation engine makes our solution uniquely powerful compared to what is currently available on the market. By measuring surface temperatures of submicron components and predicting internal temperature distributions, TMX Scientific's technology does for microelectronic component design what X-ray and MRI did for medical diagnosis.