NYU WIRELESS is a multi-disciplinary research center that is creating the fundamental theories and techniques for next-generation mass-deployable wireless devices across a wide range of applications and markets. NYU WIRELESS has state-of-the art RF/Analog circuit design, simulation, and hardware testing capabilities for semiconductor devices up to 220 GHz. Students and faculty are already familiar with proper procedures for IC design, layout, and testing, and have conducted successful tape-outs using IBM’s SOI 45 nm LEAP process (180 GHz phased array antenna) through MOSIS, as well as several successful shuttle runs on TSMC’s 130 nm process. Faculty in NYU WIRELESS are research leaders with expertise in wireless communications, distributed computing and networking, radiology, medical imaging, surgery, diagnostics, and the life sciences.