Bay Photonics are experts in Photonic Integrated Circuit (PIC) packaging for proof of concept, prototyping and production, using our extensive knowledge of semiconductor and laser/led assembly for design, development, design for manufacture (DFM), production method and test (DFT). We offer both design consultancy and bespoke assembly/packaging services to achieve the customer’s goal. The Team can assist with New Product Introduction (NPI) engineering as product line volume grows and offer services to help transfer to manufacturing facilities within the UK or to offshore Contract Electronic Manufacturers and company subsidiaries. The founders and Senior Engineers all have in depth experience with fibre optic assembly and die attach and packaging from their careers with STC, Nortel, Bookham, Gooch & Housego and Eltek Semiconductors amongst others Our brand new facilities include a ISO class 7 cleanroom and our equipment list continues to expand to meet both new and future customer demands and currently includes: Manual, semi-auto and auto die placement, die attach with flip chip capability. Manual and Auto Gold and Aluminium wire bonding , Various Optical alignment capabilities Currently commissioning an hermetic capping/seam sealing capability. Located in the South West of the UK, they have their main office at the brand new, prestiguous EPIC building which also houses other members of the Torbay Photonics Cluster ecosystem.