Imbera Electronics

www.imberacorp.com

Imbera Electronics is an industry leader in laminate based embedded die solutions. With its proprietary Integrated Module Board (IMB®) technology full turnkey solutions are available in three different application categories: single integrated circuit fan-out packages (iBGA and iQFN), Embedded System-in-Packages (iSiPs) and System-in-Boards (SiBs). The iDD (Imbera – Daeduck Ltd.) manufacturing facility is the world’s first factory dedicated to the manufacture or embedded die products. The processes from wafer thinning and dicing to embedded core manufacturing are handled under one roof. The contiguous Daeduck, a world-class PCB provider delivers high quality printed circuit board (PCB) processing for embedded cores. Back-end processes including, surface mount assembly, package solder balling, singulation and marking are performed in-house in iDD. Product offering also includes modification of customers’ integrated circuits with redistribution layers which facilitate the embedding process, as well as an extensive portfolio of supplementary back-end processes provided today through partnerships.

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Imbera Electronics is an industry leader in laminate based embedded die solutions. With its proprietary Integrated Module Board (IMB®) technology full turnkey solutions are available in three different application categories: single integrated circuit fan-out packages (iBGA and iQFN), Embedded System-in-Packages (iSiPs) and System-in-Boards (SiBs). The iDD (Imbera – Daeduck Ltd.) manufacturing facility is the world’s first factory dedicated to the manufacture or embedded die products. The processes from wafer thinning and dicing to embedded core manufacturing are handled under one roof. The contiguous Daeduck, a world-class PCB provider delivers high quality printed circuit board (PCB) processing for embedded cores. Back-end processes including, surface mount assembly, package solder balling, singulation and marking are performed in-house in iDD. Product offering also includes modification of customers’ integrated circuits with redistribution layers which facilitate the embedding process, as well as an extensive portfolio of supplementary back-end processes provided today through partnerships.

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Country

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City (Headquarters)

Espoo

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Founded

2002

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Estimated Revenue

$10,000,000 to $50,000,000

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  • Director , Technology Programs

    Email ****** @****.com
    Phone (***) ****-****

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