ICON Photonics company, France, is offering reliable and high-performance optical coupling and packaging solutions for high speed optical communications. It provides a unique 3D wafer-level polymer optical beamshaping solution that meets datacom, telecom but also free-space, sensing and quantum photonics markets. The technology main added-values are: − Optical coupling of high-speed device from standard to ultimate low size OE/EO device aperture (VCSEL, Photodiodes, PIC) − Passive and collective coupling at the wafer level for industrial deployments down to the single-chip level for prototypes development − High flexibility and customisation to meet requirements of the most challenging packaging options